Liquid cooling of AI data centers

As AI data centers push server power to unprecedented levels - reaching 600 kilowatts by 2027 and potentially megawatt-scale by the 2030s - the challenge of keeping these systems cool has never been more critical. In this episode of "We Power AI" on Podcast4Engineers, host Kelsey Markl sits down with Muzaffer Albayrak, Application Marketing Manager at Infineon, to explore the evolving world of data center cooling technologies. Together, they break down the shift from traditional air cooling to advanced liquid cooling methods, including direct-to-chip cooling, rear door heat exchangers, and immersion cooling, while examining the crucial role of Power Usage Efficiency (PUE) in measuring data center performance. The conversation dives into the semiconductor solutions - from silicon to wide-bandgap materials like silicon carbide and GaN - that power the fans, pumps, and inverters keeping these massive systems from overheating. Whether you're curious about cooling distribution units, centralized cooling architectures, or the future of AI infrastructure, this episode offers essential insights into one of the most pressing engineering challenges in the AI revolution.